LED functionality is provided by a dedicated SPI controller for driving two LED shift chains for driving the LEDs on the integrator's board. The first LED shift chain connects all of the LEDs associated with the Main Board. The second LED shift chain connects all of the LEDs associated with the Expansion Board. You can select any combination of LEDs listed in the following table to implement. You are not required to implement all of the LEDs.

Note	Both shift chains are optional. If you want any functionality from a given shift chain, then you must provide the entire shift chain. For example, if you want the copper LEDs on the Expansion Module shift chain, you must also populate the shift register associated with the SFPs interfaces.

Note

The System LED will be solid green once the unit is booted up into IOS. That is the expected behavior. The LED should stop blinking shortly after the “Taking LC1 out of reset” text if you do not have an Expansion module. If you have an expansion module, the LED will stop blinking shortly after the “Taking LC3 out of reset” text.

The following table provides details on the I/O signals.

The ESS-3300 requires integrators to provide an external connection between the CPU’s Root Complex and a PCIe endpoint on the ESS-3300 Main Module. The PCIe interface is exposed to the integrator for future use.

Integrators must connect the following Main Module I/O connector pins with PCIe Gen2 compatible AC coupling capacitors between the two pins:

A31 to B33

A32 to B34

A35 to B37

A36 to B38

The following figure shows voltage test points on the main module with descriptions in the following table.

Note	Red lines are Positive, Blue lines are Ground.

The tests listed in the following table were successfully executed on the conduction-cooled models of the Cisco ESS-3300. These tests used a representative enclosure that conforms to the mounting and thermal mechanisms shown in Thermal Design Considerations. Because this type of testing is highly dependent on factors such as the test enclosure design, the thermal solution, the front panel connectors, and the mounting, the following test results should only be used as a reference.

Both the Main Board and the Expansion Board have a temperature sensor mounted on the edge of the board and thermally attached to the cooling plate. When the temperature sensor on either the Main Board or the Expansion Board detects a temperature exceeding the temperature threshold of 203°F (95°C), the overtemperature LED will illuminate. The temperature sensor is identified as U23 in Thermal Design Considerations.

The digital temperature sensor measures the temperature of the conduction plate (or the integrators equivalent of the conduction plate), not the local ambient temperature. The product datasheet states the board will operate as long as the conduction plate is in the range of -40C to +85C. The alarms are set accordingly and the high temperature alarm thresholds are set as follows:

• Minor alarm at +80C the conduction plate temperature is close to the rated thermal limit of the unit, and will notify the user. The components are still within the specification, so there is no degradation to the long term reliability of the system.
• Major alarm at +90C the conduction plate temperature is over the rated thermal limit of the unit, and will notify the user. This will impact the long term reliability of the system.
• Critical alarm at +96C the conduction plate temperature is way over the rated thermal limit of the unit, and will notify the user. This will impact the long term reliability of the system. For the Critical Alarm threshold to be reached, it means that the ambient temperature of the system will be exceeded. Hardware failure is immanent, and the failure time will depend upon your installation. Depending on the severity at this point, the failure may be temporary or permanent.

Caution

IOS will never shut down a device because the temperature exceeds the specification. Cisco does not guarantee the functionality, nor the long term reliability of a device operating beyond Cisco specifications, but lets the device continue operating until some piece of hardware physically shuts down. Operating outside of the temperature specifications will void the product warranty.

The status of the temperature sensors can be reported from the Cisco ESS-3300 IOS CLI:

Switch# show environment all
ALARM CONTACT 1
   Status:      not asserted
   Description: external alarm contact 1
   Severity:    minor
   Trigger:     closed
ALARM CONTACT 2
   Status:      not asserted
   Description: external alarm contact 2
   Severity:    minor
   Trigger:     closed
Supervisor Temperature Value: 51 C
Temperature State: GREEN
System Temperature thresholds
-------------------------------
Minor Threshold    : 80 C (Yellow)
Major Threshold    : 90 C (Red)
Critical Threshold : 96 C 
Shutdown Threshold : 105 C 
Pwr Supply         Type     Status
------------------------------------
POWER SUPPLY-A      DC      OK
POWER SUPPLY-B      DC      OK

The following sections outline the methods for dealing with thermal issues and the mounting options involving the Cisco-designed conduction cooling plate.

As the Cisco ESS 3300 is intended for use in extreme environments, industrial temperature rated components are used. The SKUs with a thermal plate make integration easier by abstracting the component level thermal concerns. Cisco has already performed the thermal analysis at the component level so that the integrator need only be concerned with the thermal plate temperature. As a general rule, the thermal plate of the card needs to make contact with an adequate thermal mass to draw heat away from the card. This can be done in a number of ways.

Important

The thermal plate temperature, as measured at the center of the top surface of the thermal plate, must not exceed 85° C. As long as this requirement is satisfied, all of the card's components will be within a safe operating temperature range on the high temperature side.

Heat dissipation methods:

As a general rule, the thermal plate of the board needs to make contact with an adequate thermal mass to draw heat away from the board. There are many ways to achieve this goal.

Examples:

• Transfer heat away from the thermal plate and into the enclosure wall by utilizing a “shelf” of metal. The shelf encompasses the entire Cisco ESS 3300 thermal plate surface. This shelf is illustrated by item 1 in the following figure.

• Mount the Cisco ESS 3300 thermal plate directly to the enclosure wall by using thermal interface material.

Table 6. Thermal Details for the Thermally Significant Components of Cisco ESS 3300 (Main Card)

RefDes	Thermal Design Power (W)	Allowable Junction Temperature	Allowable Case Temperature	Package Type	Theta JC (degC/W)	Theta JB (degC/W)
U1	5.6	115	—	HFCBGA573	.55	5.55
U11	4.9	100	—	SFVC784	0.5	2.67
U28 U29 U30 U31 U32	0.2 each	—	95	FBGA96	3.0	—
U6 U13	1.5 each	110	—	FBGA256	13.6	16.45
U61	1	125	—	VQFN	18.8	6
U23	—	125	—	MSOP8	—	—

Note	Cisco uses the following TIMs at each REFDES:

The U23, U28, U29, U30, U31, U32, and U61 use the Chomerics GEL30. The U1, U6, U11, and U13 use the Laird TFLEX SF800. Samtec has 3D models, footprints, and schematic symbols for their connectors here:

https://www.samtec.com/connectors/high-speed-board-to-board/high-density-arrays/searay

Table 7. Thermal Details for the Thermally Significant Components of Cisco ESS-3300-24T (Expansion Card)

RefDes	Thermal Design Power (in W)	Allowable junction temp (in degC)	Allowable case temp (in degC)	Package Characteristics
				Package Type	Theta Jc (in degC/W)	Theta Jb (in degC/W)
U1,U3,U6,U7	1.5 each	110	—	FBGA256	13.6	16.45
U11	—	125	—	MSOP8	—	—

Note	U43 is the Cisco ESS-3300-24T (Expansion Board) thermal sensor.

The following tables list the product specifications for the Cisco ESS 3300.

Both the Main Board and the Expansion Board require +5 VDC and +3.3 VDC to operate. The following table lists the DC power requirements for the Main Board and the Expansion Board.

The ESS-3300 can display a POWER GOOD status for two Power Inputs via the DC-A-GOOD and DC-B-GOOD signals. If these signals are not used, connect DC-A-GOOD to 3.3 V and DC-B-GOOD to ground.

Note	There is no specific voltage sequence requirement for the 5V and 3.3V power inputs of the ESR. They can ramp up in any order.

The ESS-3300 supports IOS software control of PoE if the partner adds the appropriate circuitry to their host chassis. This is a chip to be integrated on the host motherboard, and is not an external power injector. Cisco uses the Microchip (formerly Microsemi) PD69208MILQ-TR-LE.

A maximum of 720W of power is supported through to PDs via the per port PSE controllers.

Note	The actual amount of power available for POE may be less depending on size of the power supply included by the integrator.

Note

Beginning with release 16.11.1, Cisco software started enforcing that the power bank must be set to 3 by hardware for PoE to turn on. Prior to release 16.11.1, software would let PoE turn on with any power bank setting, including Power Bank 1. The power bank should be set to 3 on all available PoE controllers (1-3).

Verify your setting through the show controller power inline CLI:

Switch#show controller power inline
Dragonite details
  Hardware version   : 0x4A02
  Product number     : 23
  Software version   : 02.1.1
  Parameter number   : 26
  Build number       : 1
  Internal SW number : 825
 
Dragonite System Status: 
  poe controller error          : 0
  firmware download is required : 0
  poe controller memory error   : 0
  Factory Default               : 0
  General Internal Error        : 0
  Private_Label                 : 0x0
  User_Byte                     : 0xFF
 
  PoE Device  | Device Fail |  Temperature Disconnect  |  Temperature Alarm
   1           0                     0                          0  
   2           1                     0                          0   
   3           1                     0                          0
  System Reset Status: 
    Low Voltage Detect     : 0
    Lockup Exception       : 0
    Illegal Opcode         : 0
    Watchdog timer         : 0
    External Rest Pin      : 0
    Power on Reset         : 0
  Reset_Info: 
    Communication reset command                 : 0
    Clock recovery failure for more than 5sec   : 0
    PoE Device failure                          : 0
    I2C module was restarted                    : 0
    Self reset                                  : 0
   Save_Command_counter                         : 0
Total Power details:
  Power Bank#              : 3
  Power Consumption[mW]    : 4000
  Calculated Power[mW]     : 8000
  Available Power[mW]      : 92000
  Power Limit [mW]         : 100000
  Max Shutdown Voltage[mW] : 57000
  Min Shutdown Voltage[mW] : 44000
  Vmain Voltage[mV]        : 53800
  Imain Current[mA]        : 0
 
Port Data[8-1]:
Current State       : 1B 1B 1B 1B 1B 01 1B 1B
Port Enabled        : 01 01 01 01 01 01 01 01
Power delivering    : 00 00 00 00 00 01 00 00
Device class        : 00 00 00 00 00 02 00 00

The integrator should contact Cisco for any additional details.

There is one Cisco SD card that has been tested and is recommended, the SD-IE-4GB. If the end user or system integrator chooses to use a 3rd party device, it may work for their application and to their satisfaction. However the end user or system integrator is solely responsible for testing and ensuring proper operation.

When a non Cisco SD card is installed, the following message appears:

WARNING: Non-IT SD flash detected. Use of this card during normal operation can impact and
severely degrade performance of the system. Please use supported SD flash cards only.

You can find Cisco’s policy on Third Party Components here:

https://www.cisco.com/c/en/us/products/warranties/warranty-doc-c99-740959.html#_Toc3320258

Both 100BASE-X and 1000BASE-X SFP transceivers are supported by the eight combo ports, four on the Main Board and four on the Expansion Board. The following table lists the specific SFP transceivers and their characteristics.

Important

The two SFP+ ports support only 10 GE SFP+ transceivers, and 1 GE SFP transceivers. 100 Mbps SFP transceivers are NOT supported on these two ports.

Note	The ESS-3300 has internal pull-ups on the I2C interfaces to the SFP. Recommend adding a weak (e.g. 100K) pull up to 3.3V on host board.